TC1-20G Chip Quik
Hersteller: Chip Quik
Thermal Interface Products Heat Sink Thermal Compound / Grease - High Density 20g Syringe 10cc
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Technische Details TC1-20G Chip Quik
Description: HEAT SINK COMPOUND - HIGH DENSIT, Packaging: Bulk, Color: White, Size / Dimension: 20 gram Syringe, Type: Silicone Compound, Thermal Conductivity: 0.67W/m-K, Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C), Shelf Life: 60 Months.
Weitere Produktangebote TC1-20G nach Preis ab 23.75 EUR bis 23.75 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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TC1-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 115 Stücke: Lieferzeit 10-14 Tag (e) |
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| TC1-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.75 EUR |