TC3-1G Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 623 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.8 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TC3-1G Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND, Packaging: Bulk, Color: Gray, Size / Dimension: 1 gram Syringe, Type: Silicone Compound, Thermal Conductivity: 8.50W/m-K, Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C), Shelf Life: 60 Months, Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C).