TDA4AL88TGAALZRQ1 Texas Instruments
Hersteller: Texas InstrumentsDescription: AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
Packaging: Cut Tape (CT)
Package / Case: 770-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 770-FCBGA (23x23)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 166.28 EUR |
| 10+ | 139.52 EUR |
| 25+ | 132.84 EUR |
| 100+ | 125.50 EUR |
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Technische Details TDA4AL88TGAALZRQ1 Texas Instruments
Description: AUTOMOTIVE SYSTEM-ON-A-CHIP FOR, Packaging: Tape & Reel (TR), Package / Case: 770-BFBGA, FCBGA, Speed: 2GHz, 1GHz, 1GHz, RAM Size: 1.5MB, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB, Peripherals: DMA, PWM, WDT, Supplier Device Package: 770-FCBGA (23x23), Architecture: DSP, MCU, MPU, Grade: Automotive, Part Status: Active, Qualification: AEC-Q100.
Weitere Produktangebote TDA4AL88TGAALZRQ1 nach Preis ab 126.76 EUR bis 174.80 EUR
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TDA4AL88TGAALZRQ1 | Hersteller : Texas Instruments |
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auf Bestellung 141 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4AL88TGAALZRQ1 | Hersteller : Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 770-Pin FCBGA T/R |
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TDA4AL88TGAALZRQ1 | Hersteller : Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 770-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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TDA4AL88TGAALZRQ1 | Hersteller : Texas Instruments |
Description: AUTOMOTIVE SYSTEM-ON-A-CHIP FOR Packaging: Tape & Reel (TR) Package / Case: 770-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 770-FCBGA (23x23) Architecture: DSP, MCU, MPU Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |