TDA4VL21HGAALZRQ1 Texas Instruments
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 177.67 EUR |
| 10+ | 149.21 EUR |
| 25+ | 142.1 EUR |
| 100+ | 134.31 EUR |
| 250+ | 130.57 EUR |
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Technische Details TDA4VL21HGAALZRQ1 Texas Instruments
Description: AUTOMOTIVE SYSTEM-ON-A-CHIP WITH, Packaging: Tape & Reel (TR), Package / Case: 770-BFBGA, FCBGA, Speed: 2GHz, 1GHz, 1GHz, RAM Size: 1.5MB, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB, Peripherals: DMA, PWM, WDT, Supplier Device Package: 770-FCBGA (23x23), Architecture: DSP, MCU, MPU, Part Status: Active, Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote TDA4VL21HGAALZRQ1 nach Preis ab 134.72 EUR bis 177.81 EUR
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TDA4VL21HGAALZRQ1 | Hersteller : Texas Instruments |
 Description: AUTOMOTIVE SYSTEM-ON-A-CHIP WITHPackaging: Cut Tape (CT) Package / Case: 770-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 770-FCBGA (23x23) Architecture: DSP, MCU, MPU Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 238 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4VL21HGAALZRQ1 | Hersteller : Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive 770-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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TDA4VL21HGAALZRQ1 | Hersteller : Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive 770-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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| TDA4VL21HGAALZRQ1 | Hersteller : Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 770-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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TDA4VL21HGAALZRQ1 | Hersteller : Texas Instruments |
Description: AUTOMOTIVE SYSTEM-ON-A-CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 770-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 770-FCBGA (23x23) Architecture: DSP, MCU, MPU Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |