TE0715-05-21C33-A Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: SOC MODULE WITH XILINX ZYNQ Z-70
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 766MHz
RAM Size: 1GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z012S-1CLG485C
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
Description: SOC MODULE WITH XILINX ZYNQ Z-70
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 766MHz
RAM Size: 1GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z012S-1CLG485C
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
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Technische Details TE0715-05-21C33-A Trenz Electronic GmbH
Description: SOC MODULE WITH XILINX ZYNQ Z-70, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), Speed: 766MHz, RAM Size: 1GB, Operating Temperature: 0°C ~ 70°C, Module/Board Type: MPU Core, Core Processor: Zynq™ XC7Z012S-1CLG485C, Co-Processor: ARM Cortex-A9, Flash Size: 32MB, Part Status: Active.
Weitere Produktangebote TE0715-05-21C33-A
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TE0715-05-21C33-A | Hersteller : Trenz Electronic | System-On-Modules - SOM SoC Module with AMD Zynq 7012S-1C, 1 GByte DDR3L, 4 x 5 cm |
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