TE0715-05-52I33-A Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: SOC MODULE WITH XILINX ZYNQ XC7Z
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
Core Processor: Zynq™ 7015 XC7Z015-2CLG485I
Description: SOC MODULE WITH XILINX ZYNQ XC7Z
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
Core Processor: Zynq™ 7015 XC7Z015-2CLG485I
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Technische Details TE0715-05-52I33-A Trenz Electronic GmbH
Description: SOC MODULE WITH XILINX ZYNQ XC7Z, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 1GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MPU Core, Co-Processor: ARM Cortex-A9, Flash Size: 32MB, Part Status: Active, Core Processor: Zynq™ 7015 XC7Z015-2CLG485I.
Weitere Produktangebote TE0715-05-52I33-A
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TE0715-05-52I33-A | Hersteller : Trenz Electronic | System-On-Modules - SOM SoC Module with AMD Zynq 7015-2I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm |
Produkt ist nicht verfügbar |