TE0729-03-62I63MAK Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: SOC MODULE WITH AMD ZYNQ 7020-2I
Packaging: Bulk
Connector Type: 2 x 120 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq™ XC7Z020-2CLG484I
Flash Size: 32MB
Description: SOC MODULE WITH AMD ZYNQ 7020-2I
Packaging: Bulk
Connector Type: 2 x 120 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq™ XC7Z020-2CLG484I
Flash Size: 32MB
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Technische Details TE0729-03-62I63MAK Trenz Electronic GmbH
Description: SOC MODULE WITH AMD ZYNQ 7020-2I, Packaging: Bulk, Connector Type: 2 x 120 Pin, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 512MB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: FPGA, Core Processor: ARM® Cortex®-A9, Co-Processor: Zynq™ XC7Z020-2CLG484I, Flash Size: 32MB.
Weitere Produktangebote TE0729-03-62I63MAK
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| TE0729-03-62I63MAK | Hersteller : Trenz Electronic | System-On-Modules - SOM SoC Module with AMD Zynq 7020-2I incl. pre-assembled Heat Spreader |
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