TE0745-02-93E31-AK Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: SOM WITH XILINX ZYNQ 7045-3E AND
Packaging: Bulk
Part Status: Active
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 64MB
Description: SOM WITH XILINX ZYNQ 7045-3E AND
Packaging: Bulk
Part Status: Active
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 64MB
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Technische Details TE0745-02-93E31-AK Trenz Electronic GmbH
Description: SOM WITH XILINX ZYNQ 7045-3E AND, Packaging: Bulk, Part Status: Active, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 1GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MPU Core, Co-Processor: ARM Cortex-A9, Flash Size: 64MB.
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| TE0745-02-93E31-AK | Hersteller : Trenz Electronic |
 System-On-Modules - SOM SoM with Xilinx Zynq 7045-3E and Heat Spreader,1 GByte DDR3L SDRAM, 5.2 x 7.6 cm |
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