TE0807-03-4BE21-A Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
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Technische Details TE0807-03-4BE21-A Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket - 160, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E, Flash Size: 128MB.
Weitere Produktangebote TE0807-03-4BE21-A
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| TE0807-03-4BE21-A | Hersteller : Trenz Electronic | System-On-Modules - SOM MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm |
Produkt ist nicht verfügbar |