TE0813-01-2BE11-A Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details TE0813-01-2BE11-A Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket - 240, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E, Flash Size: 128MB, Part Status: Active.
Weitere Produktangebote TE0813-01-2BE11-A
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
TE0813-01-2BE11-A | Hersteller : Trenz Electronic | System-On-Modules - SOM MPSoC Module with AMD Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm |
Produkt ist nicht verfügbar |