TE0820-05-3BE81ML Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
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Technische Details TE0820-05-3BE81ML Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Connector Type: 2 x 100 Pin, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E, Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, Flash Size: 128MB.
Weitere Produktangebote TE0820-05-3BE81ML
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|---|---|---|---|---|---|
| TE0820-05-3BE81ML | Hersteller : Trenz Electronic | Trenz Electronic MPSoC Module with AMD Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP |
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