Technische Details TE0821-01-3BI21MA Trenz Electronic
Description: MPSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Connector Type: 2 x 160 Pin, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 2GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I, Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, Flash Size: 128MB.
Weitere Produktangebote TE0821-01-3BI21MA
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TE0821-01-3BI21MA | Hersteller : Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 160 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
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TE0821-01-3BI21MA | Hersteller : Trenz Electronic | System-On-Modules - SOM MPSoC Module with AMD Zynq UltraScale+ ZU3EG-1I, 2 GByte DDR4, 4 x 5 cm |
Produkt ist nicht verfügbar |