TE0835-02-MXE21-A Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
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Technische Details TE0835-02-MXE21-A Trenz Electronic GmbH
Description: RFSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm), Speed: 1.3GHz, RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E, Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, Flash Size: 128MB.
Weitere Produktangebote TE0835-02-MXE21-A
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TE0835-02-MXE21-A | Hersteller : Trenz Electronic | System-On-Modules - SOM RFSoC Module with AMD Zynq UltraScale+ ZU25DR-1E, 4 GByte DDR4, 6.5 x 9 cm |
Produkt ist nicht verfügbar |