TEM-110-02-03.0-H-D-WT Samtec

Description: CONN HEADER SMD 20POS 0.8MM, Row Spacing - Mating: 0.063" (1.60mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.220" (5.60mm), Contact Shape: Square, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.031" (0.80mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Rows: 2, Number of Positions: 20, Mounting Type: Surface Mount, Current Rating (Amps): 2.9A per Contact, Connector Type: Header, Features: Solder Retention, Packaging: Tray.