TFM-115-01-L-D-RA Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 5.37 EUR |
| 25+ | 4.93 EUR |
| 50+ | 4.65 EUR |
| 100+ | 4.4 EUR |
| 500+ | 4.14 EUR |
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Technische Details TFM-115-01-L-D-RA Samtec
Description: CONN HEADER R/A 30POS 1.27MM, Current Rating (Amps): 3.2A per Contact, Voltage Rating: 275VAC, Connector Type: Header, Packaging: Tube, Contact Length - Mating: 0.142" (3.61mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.225" (5.72mm), Contact Length - Post: 0.075" (1.91mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 30, Mounting Type: Through Hole, Right Angle.
Weitere Produktangebote TFM-115-01-L-D-RA nach Preis ab 3.69 EUR bis 6.39 EUR
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TFM-115-01-L-D-RA | Hersteller : Samtec Inc. |
 Description: CONN HEADER R/A 30POS 1.27MMCurrent Rating (Amps): 3.2A per Contact Voltage Rating: 275VAC Connector Type: Header Packaging: Tube Contact Length - Mating: 0.142" (3.61mm) Row Spacing - Mating: 0.050" (1.27mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Shrouded - 4 Wall Insulation Height: 0.225" (5.72mm) Contact Length - Post: 0.075" (1.91mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 2 Number of Positions: 30 Mounting Type: Through Hole, Right Angle |
auf Bestellung 4855 Stücke: Lieferzeit 10-14 Tag (e) |
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TFM-115-01-L-D-RA | Hersteller : SAMTEC |
Description: SAMTEC - TFM-115-01-L-D-RA - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 30Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Tiger Eye TFM productTraceability: No Kontaktanschluss: Durchsteckmontage, abgewinkelt Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (04-Feb-2026) |
auf Bestellung 10 Stücke: Lieferzeit 14-21 Tag (e) |