TFM-115-02-L-D Samtec Inc.

Description: CONN HEADER SMD 30POS 1.27MM, Contact Length - Mating: 0.131" (3.33mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.220" (5.60mm), Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 30, Mounting Type: Surface Mount, Current Rating (Amps): 3.2A per Contact, Voltage Rating: 275VAC, Connector Type: Header, Packaging: Tube.