
TFM-115-02-S-D-WT-P-TR Samtec
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 7.30 EUR |
10+ | 7.08 EUR |
25+ | 6.78 EUR |
50+ | 6.48 EUR |
100+ | 6.18 EUR |
275+ | 6.16 EUR |
550+ | 5.86 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TFM-115-02-S-D-WT-P-TR Samtec
Description: CONN HEADER SMD 30POS 1.27MM, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 275VAC, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.131" (3.33mm).
Weitere Produktangebote TFM-115-02-S-D-WT-P-TR nach Preis ab 12.40 EUR bis 15.42 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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TFM-115-02-S-D-WT-P-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 30POS 1.27MM Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
auf Bestellung 245 Stücke: Lieferzeit 10-14 Tag (e) |
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TFM-115-02-S-D-WT-P-TR | Hersteller : SAMTEC |
![]() tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 30Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbindertyp: PCB Header Produktpalette: Tiger Eye TFM Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 47 Stücke: Lieferzeit 14-21 Tag (e) |
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TFM-115-02-S-D-WT-P-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 30POS 1.27MM Features: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
Produkt ist nicht verfügbar |