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TI60W64C3 Efinix, Inc.


titanium60-ds-v2.0.pdf Hersteller: Efinix, Inc.
Description: FPGA TITAN 35HSIO 2PLL 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-BGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 62016
Supplier Device Package: 64-WLCSP (3.5x3.4)
Total RAM Bits: 2726298
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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Technische Details TI60W64C3 Efinix, Inc.

Description: FPGA TITAN 35HSIO 2PLL 64WLCSP, Packaging: Tape & Reel (TR), Package / Case: 64-BGA, WLCSP, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 0.92V ~ 0.98V, Number of Logic Elements/Cells: 62016, Supplier Device Package: 64-WLCSP (3.5x3.4), Total RAM Bits: 2726298, Part Status: Active, Number of I/O: 34, DigiKey Programmable: Not Verified.

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TI60W64C3 Hersteller : Efinix, Inc. titanium60-ds-v2.0.pdf Description: FPGA TITAN 35HSIO 2PLL 64WLCSP
Packaging: Cut Tape (CT)
Package / Case: 64-BGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 62016
Supplier Device Package: 64-WLCSP (3.5x3.4)
Total RAM Bits: 2726298
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar