TMM-108-01-G-S-SM Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 4.1 EUR |
| 10+ | 3.64 EUR |
| 105+ | 3.24 EUR |
| 525+ | 2.69 EUR |
| 1015+ | 2.31 EUR |
| 2520+ | 2.25 EUR |
| 5005+ | 2.04 EUR |
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Technische Details TMM-108-01-G-S-SM Samtec
Description: CONN HEADER SMD 8POS 2MM, Style: Board to Board or Cable, Number of Rows: 1, Contact Length - Mating: 0.126" (3.20mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.059" (1.50mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Number of Positions: 8, Mounting Type: Surface Mount, Current Rating (Amps): 3.2A per Contact, Connector Type: Header, Packaging: Bulk.
Weitere Produktangebote TMM-108-01-G-S-SM nach Preis ab 3.06 EUR bis 4.49 EUR
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TMM-108-01-G-S-SM | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 8POS 2MMStyle: Board to Board or Cable Number of Rows: 1 Contact Length - Mating: 0.126" (3.20mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.059" (1.50mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 3.2A per Contact Connector Type: Header Packaging: Bulk |
auf Bestellung 1408 Stücke: Lieferzeit 10-14 Tag (e) |
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