TMS320C28343ZFET Texas Instruments
Hersteller: Texas Instruments
Description: IC DSP FLOATING POINT 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Interface: CAN, EBI/EMI, I2C, McBSP, SCI, SPI
Type: Floating Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (16kB)
On-Chip RAM: 260kB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 200MHz
Supplier Device Package: 256-BGA (17x17)
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Technische Details TMS320C28343ZFET Texas Instruments
Description: IC DSP FLOATING POINT 256BGA, Packaging: Tray, Package / Case: 256-BGA, Mounting Type: Surface Mount, Interface: CAN, EBI/EMI, I2C, McBSP, SCI, SPI, Type: Floating Point, Operating Temperature: -40°C ~ 105°C (TJ), Non-Volatile Memory: ROM (16kB), On-Chip RAM: 260kB, Voltage - I/O: 3.30V, Voltage - Core: 1.10V, Clock Rate: 200MHz, Supplier Device Package: 256-BGA (17x17).
Weitere Produktangebote TMS320C28343ZFET
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
TMS320C28343ZFET | Texas Instruments |
Description: IC DSP FLOATING POINT 256BGAPackaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Interface: CAN, EBI/EMI, I2C, McBSP, SCI, SPI Type: Floating Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (16kB) On-Chip RAM: 260kB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 200MHz Supplier Device Package: 256-BGA (17x17) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH |
| TMS320C28343ZFET |
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Hersteller: Texas Instruments
Description: IC DSP FLOATING POINT 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Interface: CAN, EBI/EMI, I2C, McBSP, SCI, SPI
Type: Floating Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (16kB)
On-Chip RAM: 260kB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 200MHz
Supplier Device Package: 256-BGA (17x17)
Description: IC DSP FLOATING POINT 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Interface: CAN, EBI/EMI, I2C, McBSP, SCI, SPI
Type: Floating Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (16kB)
On-Chip RAM: 260kB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 200MHz
Supplier Device Package: 256-BGA (17x17)
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH

