TMS320C6424ZDU7 Texas Instruments
Hersteller: Texas Instruments
Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc
Produktrezensionen
Produktbewertung abgeben
Technische Details TMS320C6424ZDU7 Texas Instruments
Description: IC DSP FIXED-POINT 376-BGA, Packaging: Tray, Package / Case: 376-BBGA Exposed Pad, Mounting Type: Surface Mount, Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC, Type: Fixed Point, Operating Temperature: 0°C ~ 90°C (TJ), Non-Volatile Memory: ROM (64kB), On-Chip RAM: 240kB, Voltage - I/O: 1.8V, 3.3V, Voltage - Core: 1.05V, 1.20V, Clock Rate: 700MHz, Supplier Device Package: 376-BGA (23x23), Part Status: Active.
Weitere Produktangebote TMS320C6424ZDU7 nach Preis ab 66.34 EUR bis 82.96 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||
|---|---|---|---|---|---|---|---|---|---|
 |
TMS320C6424ZDU7 | Texas Instruments |
Description: IC DSP FIXED-POINT 376-BGA Packaging: Tray Package / Case: 376-BBGA Exposed Pad Mounting Type: Surface Mount Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC Type: Fixed Point Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: ROM (64kB) On-Chip RAM: 240kB Voltage - I/O: 1.8V, 3.3V Voltage - Core: 1.05V, 1.20V Clock Rate: 700MHz Supplier Device Package: 376-BGA (23x23) Part Status: Active |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||
|
|
TMS320C6424ZDU7 | Texas Instruments |
Description: IC DSP FIXED-POINT 376-BGA Supplier Device Package: 376-BGA (23x23) Clock Rate: 700MHz Voltage - Core: 1.05V, 1.20V Voltage - I/O: 1.8V, 3.3V On-Chip RAM: 240kB Non-Volatile Memory: ROM (64kB) Operating Temperature: 0°C ~ 90°C (TJ) Type: Fixed Point Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC Mounting Type: Surface Mount Package / Case: 376-BBGA Exposed Pad Packaging: Bulk |
auf Bestellung 89 Stücke: Lieferzeit 10-14 Tag (e) |
|
| TMS320C6424ZDU7 |
|
Hersteller: Texas Instruments
Description: IC DSP FIXED-POINT 376-BGA
Packaging: Tray
Package / Case: 376-BBGA Exposed Pad
Mounting Type: Surface Mount
Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC
Type: Fixed Point
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: ROM (64kB)
On-Chip RAM: 240kB
Voltage - I/O: 1.8V, 3.3V
Voltage - Core: 1.05V, 1.20V
Clock Rate: 700MHz
Supplier Device Package: 376-BGA (23x23)
Part Status: Active
Description: IC DSP FIXED-POINT 376-BGA
Packaging: Tray
Package / Case: 376-BBGA Exposed Pad
Mounting Type: Surface Mount
Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC
Type: Fixed Point
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: ROM (64kB)
On-Chip RAM: 240kB
Voltage - I/O: 1.8V, 3.3V
Voltage - Core: 1.05V, 1.20V
Clock Rate: 700MHz
Supplier Device Package: 376-BGA (23x23)
Part Status: Active
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 80.4 EUR |
| 10+ | 66.34 EUR |
| TMS320C6424ZDU7 |
|
Hersteller: Texas Instruments
Description: IC DSP FIXED-POINT 376-BGA
Supplier Device Package: 376-BGA (23x23)
Clock Rate: 700MHz
Voltage - Core: 1.05V, 1.20V
Voltage - I/O: 1.8V, 3.3V
On-Chip RAM: 240kB
Non-Volatile Memory: ROM (64kB)
Operating Temperature: 0°C ~ 90°C (TJ)
Type: Fixed Point
Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC
Mounting Type: Surface Mount
Package / Case: 376-BBGA Exposed Pad
Packaging: Bulk
Description: IC DSP FIXED-POINT 376-BGA
Supplier Device Package: 376-BGA (23x23)
Clock Rate: 700MHz
Voltage - Core: 1.05V, 1.20V
Voltage - I/O: 1.8V, 3.3V
On-Chip RAM: 240kB
Non-Volatile Memory: ROM (64kB)
Operating Temperature: 0°C ~ 90°C (TJ)
Type: Fixed Point
Interface: EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC
Mounting Type: Surface Mount
Package / Case: 376-BBGA Exposed Pad
Packaging: Bulk
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 82.96 EUR |