Technische Details TS991AX500T4C Chip Quik
Description: SOLDER PASTE SN63/PB37 T4 90.25%, Packaging: Bulk, Composition: Sn63Pb37 (63/37), Type: Solder Paste, Melting Point: 361°F (183°C), Form: Cartridge, 17.64 oz (500g), Mesh Type: 4, Process: Leaded, Flux Type: No-Clean, Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C), Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.
Weitere Produktangebote TS991AX500T4C nach Preis ab 156.08 EUR bis 156.08 EUR
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TS991AX500T4C | Hersteller : Chip Quik Inc. |
 Description: SOLDER PASTE SN63/PB37 T4 90.25%Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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