| Anzahl | Preis |
|---|---|
| 4+ | 0.91 EUR |
| 50+ | 0.71 EUR |
| 100+ | 0.57 EUR |
| 500+ | 0.49 EUR |
| 1000+ | 0.47 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-102-01-F-DV Samtec
Description: CONN HEADER SMD 4POS 2.54MM, Packaging: Bulk, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 4, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-102-01-F-DV nach Preis ab 0.47 EUR bis 0.95 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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TSM-102-01-F-DV | Samtec Inc. |
 Description: CONN HEADER SMD 4POS 2.54MMPackaging: Bulk Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 4 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 9231 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-102-01-F-DV | SAMTEC |
Description: SAMTEC - TSM-102-01-F-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 4 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 4Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Steckverbinder: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 170 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH |
| TSM-102-01-F-DV |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 4POS 2.54MM
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 4
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER SMD 4POS 2.54MM
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 4
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
auf Bestellung 9231 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 19+ | 0.95 EUR |
| 50+ | 0.74 EUR |
| 100+ | 0.59 EUR |
| 500+ | 0.51 EUR |
| 1000+ | 0.47 EUR |
| TSM-102-01-F-DV |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-102-01-F-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 4 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 4Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - TSM-102-01-F-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 4 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 4Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 170 Stücke:
Lieferzeit 14-21 Tag (e)