TSM-103-01-F-SH Samtec
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.43 EUR |
| 10+ | 1.23 EUR |
| 76+ | 0.95 EUR |
| 532+ | 0.67 EUR |
| 1064+ | 0.63 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-103-01-F-SH Samtec
Description: CONN HEADER SMD R/A 3POS 2.54MM, Contact Length - Mating: 0.230" (5.84mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.120" (3.05mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 1, Number of Positions: 3, Mounting Type: Surface Mount, Right Angle, Connector Type: Header, Packaging: Tube.
Weitere Produktangebote TSM-103-01-F-SH nach Preis ab 1.23 EUR bis 1.44 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||
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TSM-103-01-F-SH | Samtec Inc. |
Description: CONN HEADER SMD R/A 3POS 2.54MMContact Length - Mating: 0.230" (5.84mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.120" (3.05mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 1 Number of Positions: 3 Mounting Type: Surface Mount, Right Angle Connector Type: Header Packaging: Tube |
auf Bestellung 77 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-103-01-F-SH | SAMTEC |
Description: SAMTEC - TSM-103-01-F-SH - Stiftleiste, Board-to-Board, Wire-to-Board, 2.54 mm, 1 Reihe(n), 3 Kontakt(e)tariffCode: 85366930 productTraceability: No Kontaktüberzug: 0 Kontaktanschluss: 0 rohsCompliant: YES Rastermaß: 0 Anzahl der Kontakte: 0 euEccn: NLR Steckverbindersysteme: 0 Anzahl der Reihen: 0 Kontaktmaterial: 0 Steckverbinderkragen: 0 hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: TSM Series SVHC: No SVHC (14-Jun-2023) |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH |
| TSM-103-01-F-SH |
![]() |
Hersteller: Samtec Inc.
Description: CONN HEADER SMD R/A 3POS 2.54MM
Contact Length - Mating: 0.230" (5.84mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.120" (3.05mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount, Right Angle
Connector Type: Header
Packaging: Tube
Description: CONN HEADER SMD R/A 3POS 2.54MM
Contact Length - Mating: 0.230" (5.84mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.120" (3.05mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount, Right Angle
Connector Type: Header
Packaging: Tube
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 1.44 EUR |
| 18+ | 1.23 EUR |
| TSM-103-01-F-SH |
![]() |
Hersteller: SAMTEC
Description: SAMTEC - TSM-103-01-F-SH - Stiftleiste, Board-to-Board, Wire-to-Board, 2.54 mm, 1 Reihe(n), 3 Kontakt(e)
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: 0
Kontaktanschluss: 0
rohsCompliant: YES
Rastermaß: 0
Anzahl der Kontakte: 0
euEccn: NLR
Steckverbindersysteme: 0
Anzahl der Reihen: 0
Kontaktmaterial: 0
Steckverbinderkragen: 0
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: TSM Series
SVHC: No SVHC (14-Jun-2023)
Description: SAMTEC - TSM-103-01-F-SH - Stiftleiste, Board-to-Board, Wire-to-Board, 2.54 mm, 1 Reihe(n), 3 Kontakt(e)
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: 0
Kontaktanschluss: 0
rohsCompliant: YES
Rastermaß: 0
Anzahl der Kontakte: 0
euEccn: NLR
Steckverbindersysteme: 0
Anzahl der Reihen: 0
Kontaktmaterial: 0
Steckverbinderkragen: 0
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: TSM Series
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)



