TSM-104-01-S-DH-008 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HEADER SMD R/A 8POS 2.54MM
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: 7
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 8
Mounting Type: Surface Mount, Right Angle
Contact Length - Mating: 0.230" (5.84mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.240" (6.10mm)
Connector Type: Header
Packaging: Bulk
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Technische Details TSM-104-01-S-DH-008 Samtec Inc.
Description: CONN HEADER SMD R/A 8POS 2.54MM, Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: 7, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 8, Mounting Type: Surface Mount, Right Angle, Contact Length - Mating: 0.230" (5.84mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.240" (6.10mm), Connector Type: Header, Packaging: Bulk.
Weitere Produktangebote TSM-104-01-S-DH-008
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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TSM-104-01-S-DH-008 | Hersteller : Samtec |
Headers & Wire Housings .100" Surface Mount Terminal Strip |
Produkt ist nicht verfügbar |
