TSM-104-01-S-DV-P-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HEADER SMD 8POS 2.54MM
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
auf Bestellung 7400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 200+ | 2.01 EUR |
| 600+ | 1.66 EUR |
| 1000+ | 1.54 EUR |
| 5000+ | 1.02 EUR |
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Technische Details TSM-104-01-S-DV-P-TR Samtec Inc.
Description: CONN HEADER SMD 8POS 2.54MM, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 8, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-104-01-S-DV-P-TR nach Preis ab 1.04 EUR bis 2.43 EUR
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TSM-104-01-S-DV-P-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 8POS 2.54MM Packaging: Cut Tape (CT) Features: Pick and Place Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 8 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 7769 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-104-01-S-DV-P-TR | Hersteller : Samtec |
Headers & Wire Housings .100" Surface Mount Terminal Strip |
auf Bestellung 2560 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-104-01-S-DV-P-TR | Hersteller : SAMTEC |
Description: SAMTEC - TSM-104-01-S-DV-P-TR - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 8 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbindertyp: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 570 Stücke: Lieferzeit 14-21 Tag (e) |