TSM-106-01-F-DV Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.64 EUR |
| 10+ | 2.87 EUR |
| 114+ | 2.84 EUR |
| 532+ | 2.37 EUR |
| 1026+ | 1.77 EUR |
| 2508+ | 1.75 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-106-01-F-DV Samtec
Description: CONN HEADER SMD 12POS 2.54MM, Contact Length - Mating: 0.230" (5.84mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.100" (2.54mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 12, Mounting Type: Surface Mount, Connector Type: Header, Packaging: Tube.
Weitere Produktangebote TSM-106-01-F-DV nach Preis ab 2.39 EUR bis 3.69 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TSM-106-01-F-DV | Samtec Inc. |
 Description: CONN HEADER SMD 12POS 2.54MMContact Length - Mating: 0.230" (5.84mm) Row Spacing - Mating: 0.100" (2.54mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.100" (2.54mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 2 Number of Positions: 12 Mounting Type: Surface Mount Connector Type: Header Packaging: Tube |
auf Bestellung 645 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-106-01-F-DV | SAMTEC |
Description: SAMTEC - TSM-106-01-F-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 12 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 12Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbindertyp: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 33 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| TSM-106-01-F-DV |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 12POS 2.54MM
Contact Length - Mating: 0.230" (5.84mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 12
Mounting Type: Surface Mount
Connector Type: Header
Packaging: Tube
Description: CONN HEADER SMD 12POS 2.54MM
Contact Length - Mating: 0.230" (5.84mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 12
Mounting Type: Surface Mount
Connector Type: Header
Packaging: Tube
auf Bestellung 645 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.69 EUR |
| 10+ | 3.21 EUR |
| 100+ | 2.87 EUR |
| 500+ | 2.39 EUR |
| TSM-106-01-F-DV |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-106-01-F-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 12 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 12Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbindertyp: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (21-Jan-2025)
Description: SAMTEC - TSM-106-01-F-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 12 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 12Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbindertyp: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (21-Jan-2025)
auf Bestellung 33 Stücke:
Lieferzeit 14-21 Tag (e)