TSM-107-01-L-DV-006 Samtec
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.59 EUR |
| 50+ | 2.45 EUR |
| 96+ | 2.15 EUR |
| 1024+ | 1.84 EUR |
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Technische Details TSM-107-01-L-DV-006 Samtec
Description: CONN HEADER SMD 14POS 2.54MM, Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.100" (2.54mm), Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: 13, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Number of Rows: 2, Number of Positions: 14, Mounting Type: Surface Mount, Connector Type: Header, Cuttable, Packaging: Tube, Style: Board to Board or Cable, Contact Length - Mating: 0.230" (5.84mm), Row Spacing - Mating: 0.100" (2.54mm).
Weitere Produktangebote TSM-107-01-L-DV-006 nach Preis ab 2.28 EUR bis 4.7 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TSM-107-01-L-DV-006 | Samtec Inc. |
 Description: CONN HEADER SMD 14POS 2.54MMInsulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.100" (2.54mm) Contact Shape: Square Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: 13 Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Number of Rows: 2 Number of Positions: 14 Mounting Type: Surface Mount Connector Type: Header, Cuttable Packaging: Tube Style: Board to Board or Cable Contact Length - Mating: 0.230" (5.84mm) Row Spacing - Mating: 0.100" (2.54mm) |
auf Bestellung 2132 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-107-01-L-DV-006 | SAMTEC |
Description: SAMTEC - TSM-107-01-L-DV-006 - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 14Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Steckverbinder: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 74 Stücke: Lieferzeit 14-21 Tag (e) |
|
| TSM-107-01-L-DV-006 |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 14POS 2.54MM
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: 13
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Number of Rows: 2
Number of Positions: 14
Mounting Type: Surface Mount
Connector Type: Header, Cuttable
Packaging: Tube
Style: Board to Board or Cable
Contact Length - Mating: 0.230" (5.84mm)
Row Spacing - Mating: 0.100" (2.54mm)
Description: CONN HEADER SMD 14POS 2.54MM
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: 13
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Number of Rows: 2
Number of Positions: 14
Mounting Type: Surface Mount
Connector Type: Header, Cuttable
Packaging: Tube
Style: Board to Board or Cable
Contact Length - Mating: 0.230" (5.84mm)
Row Spacing - Mating: 0.100" (2.54mm)
auf Bestellung 2132 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.83 EUR |
| 50+ | 3.36 EUR |
| 100+ | 3.02 EUR |
| 500+ | 2.57 EUR |
| 1000+ | 2.28 EUR |
| TSM-107-01-L-DV-006 |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-107-01-L-DV-006 - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - TSM-107-01-L-DV-006 - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 74 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 54+ | 4.7 EUR |
| 61+ | 3.86 EUR |