TSM-108-01-F-SV-P-TR Samtec
| Anzahl | Privatkunde |
|---|---|
| 2+ | 3.17 EUR |
| 50+ | 2.64 EUR |
| 100+ | 2.24 EUR |
| 1000+ | 1.7 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-108-01-F-SV-P-TR Samtec
Description: CONN HEADER SMD 8POS 2.54MM, Shrouding: Unshrouded, Insulation Height: 0.100" (2.54mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Contact Length - Mating: 0.230" (5.84mm), Insulation Material: Liquid Crystal Polymer (LCP), Style: Board to Board or Cable, Number of Rows: 1, Number of Positions: 8, Mounting Type: Surface Mount, Connector Type: Header, Features: Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote TSM-108-01-F-SV-P-TR nach Preis ab 2.14 EUR bis 3.97 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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TSM-108-01-F-SV-P-TR | Samtec Inc. |
 Description: CONN HEADER SMD 8POS 2.54MMTermination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 1 Number of Positions: 8 Mounting Type: Surface Mount Connector Type: Header Features: Pick and Place Packaging: Cut Tape (CT) Contact Length - Mating: 0.230" (5.84mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.100" (2.54mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-108-01-F-SV-P-TR | SAMTEC |
Description: SAMTEC - TSM-108-01-F-SV-P-TR - Stiftleiste, Board-to-Board, Wire-to-Board, 2.54 mm, 1 Reihe(n), 8 Kontakt(e) tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Hauchvergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbinder: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade usEccn: EAR99 Anzahl der Reihen: 1Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 483 Stücke: Lieferzeit 14-21 Tag (e) |
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| TSM-108-01-F-SV-P-TR |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 8POS 2.54MM
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Connector Type: Header
Features: Pick and Place
Packaging: Cut Tape (CT)
Contact Length - Mating: 0.230" (5.84mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Description: CONN HEADER SMD 8POS 2.54MM
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Connector Type: Header
Features: Pick and Place
Packaging: Cut Tape (CT)
Contact Length - Mating: 0.230" (5.84mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.96 EUR |
| 10+ | 3.44 EUR |
| TSM-108-01-F-SV-P-TR |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-108-01-F-SV-P-TR - Stiftleiste, Board-to-Board, Wire-to-Board, 2.54 mm, 1 Reihe(n), 8 Kontakt(e)
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Hauchvergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - TSM-108-01-F-SV-P-TR - Stiftleiste, Board-to-Board, Wire-to-Board, 2.54 mm, 1 Reihe(n), 8 Kontakt(e)
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Hauchvergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 483 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 63+ | 3.97 EUR |
| 78+ | 3 EUR |
| 101+ | 2.14 EUR |