
TSM-108-01-L-DV-P Samtec
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 3.71 EUR |
56+ | 3.24 EUR |
112+ | 2.92 EUR |
504+ | 2.46 EUR |
1008+ | 2.29 EUR |
Produktrezensionen
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Technische Details TSM-108-01-L-DV-P Samtec
Description: CONN HEADER SMD 16POS 2.54MM, Packaging: Tube, Features: Pick and Place, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-108-01-L-DV-P nach Preis ab 4.79 EUR bis 5.28 EUR
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TSM-108-01-L-DV-P | Hersteller : Samtec Inc. |
![]() Packaging: Tube Features: Pick and Place Connector Type: Header Mounting Type: Surface Mount Number of Positions: 16 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 76 Stücke: Lieferzeit 10-14 Tag (e) |
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