TSM-108-02-S-DV Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 4.89 EUR |
| 56+ | 4.29 EUR |
| 112+ | 3.85 EUR |
| 504+ | 3.27 EUR |
| 1008+ | 3.03 EUR |
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Technische Details TSM-108-02-S-DV Samtec
Description: CONN HEADER SMD 16POS 2.54MM, Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 16, Mounting Type: Surface Mount, Connector Type: Header, Packaging: Tube, Contact Length - Mating: 0.320" (8.13mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.100" (2.54mm).
Weitere Produktangebote TSM-108-02-S-DV nach Preis ab 5.05 EUR bis 7.43 EUR
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TSM-108-02-S-DV | Hersteller : Samtec Inc. |
 Description: CONN HEADER SMD 16POS 2.54MMContact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 2 Number of Positions: 16 Mounting Type: Surface Mount Connector Type: Header Packaging: Tube Contact Length - Mating: 0.320" (8.13mm) Row Spacing - Mating: 0.100" (2.54mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.100" (2.54mm) |
auf Bestellung 519 Stücke: Lieferzeit 10-14 Tag (e) |
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