TSM-108-03-S-DV Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.26 EUR |
| 56+ | 5.46 EUR |
| 112+ | 4.9 EUR |
| 504+ | 4.16 EUR |
| 1008+ | 3.83 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-108-03-S-DV Samtec
Description: CONN HEADER SMD 16POS 2.54MM, Packaging: Tube, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.420" (10.67mm).
Weitere Produktangebote TSM-108-03-S-DV nach Preis ab 5.96 EUR bis 8.76 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TSM-108-03-S-DV | Samtec Inc. |
 Description: CONN HEADER SMD 16POS 2.54MMPackaging: Tube Connector Type: Header Mounting Type: Surface Mount Number of Positions: 16 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.420" (10.67mm) |
auf Bestellung 616 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-108-03-S-DV | SAMTEC |
Description: SAMTEC - TSM-108-03-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbindertyp: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| TSM-108-03-S-DV |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 16POS 2.54MM
Packaging: Tube
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 16
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.420" (10.67mm)
Description: CONN HEADER SMD 16POS 2.54MM
Packaging: Tube
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 16
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.420" (10.67mm)
auf Bestellung 616 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.76 EUR |
| 10+ | 7.96 EUR |
| 100+ | 7.01 EUR |
| 500+ | 5.96 EUR |
| TSM-108-03-S-DV |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-108-03-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbindertyp: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (21-Jan-2025)
Description: SAMTEC - TSM-108-03-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbindertyp: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (21-Jan-2025)
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)