| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.47 EUR |
| 22+ | 5.87 EUR |
| 44+ | 5.18 EUR |
| 110+ | 3.89 EUR |
| 506+ | 3.45 EUR |
| 1012+ | 3.44 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-110-01-S-DV Samtec
Description: CONN HEADER SMD 20POS 2.54MM, Packaging: Tube, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-110-01-S-DV nach Preis ab 3.89 EUR bis 6.47 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TSM-110-01-S-DV | Samtec Inc. |
 Description: CONN HEADER SMD 20POS 2.54MMPackaging: Tube Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 773 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
 |
TSM-110-01-S-DV | SAMTEC |
Description: SAMTEC - TSM-110-01-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (17-Jan-2023) |
auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| TSM-110-01-S-DV |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
auf Bestellung 773 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.47 EUR |
| 25+ | 5.85 EUR |
| 50+ | 5.44 EUR |
| 100+ | 5.18 EUR |
| 500+ | 3.89 EUR |
| TSM-110-01-S-DV |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-110-01-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (17-Jan-2023)
Description: SAMTEC - TSM-110-01-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (17-Jan-2023)
auf Bestellung 5 Stücke:
Lieferzeit 14-21 Tag (e)