TSM-113-01-L-DV-A-P-TR Samtec
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.06 EUR |
| 10+ | 8.71 EUR |
| 125+ | 7.25 EUR |
| 500+ | 6.16 EUR |
| 1000+ | 5.26 EUR |
| 2500+ | 4.82 EUR |
| 5000+ | 4.72 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-113-01-L-DV-A-P-TR Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-113-01-L-DV-A-P-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
TSM-113-01-L-DV-A-P-TR | Hersteller : Samtec |
 Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD T/R |
Produkt ist nicht verfügbar |
|
 |
TSM-113-01-L-DV-A-P-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 26POS 2.54MM Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
Produkt ist nicht verfügbar |
|
|
|
TSM-113-01-L-DV-A-P-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 26POS 2.54MM Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
Produkt ist nicht verfügbar |