| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.87 EUR |
| 51+ | 5.38 EUR |
| 102+ | 4.77 EUR |
| 510+ | 4.24 EUR |
| 1003+ | 3.8 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TSM-113-01-L-DV Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Packaging: Tube, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-113-01-L-DV nach Preis ab 3.37 EUR bis 7.54 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TSM-113-01-L-DV | Samtec Inc. |
 Description: CONN HEADER SMD 26POS 2.54MMPackaging: Tube Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 466 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-113-01-L-DV | Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube |
auf Bestellung 1241 Stücke: Lieferzeit 14-21 Tag (e) |
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TSM-113-01-L-DV | SAMTEC |
Description: SAMTEC - TSM-113-01-L-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 26Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Steckverbinder: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 58 Stücke: Lieferzeit 14-21 Tag (e) |
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TSM-113-01-L-DV | Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube |
auf Bestellung 17 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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TSM-113-01-L-DV | Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube |
auf Bestellung 17 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 3 Stücke Im Einkaufswagen Stück im Wert von UAH |
| TSM-113-01-L-DV |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
auf Bestellung 466 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.45 EUR |
| 50+ | 5.95 EUR |
| 100+ | 5.26 EUR |
| TSM-113-01-L-DV |
|
Hersteller: Samtec
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube
auf Bestellung 1241 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 24+ | 7.44 EUR |
| 102+ | 5.82 EUR |
| 255+ | 5.33 EUR |
| 510+ | 4.89 EUR |
| 1003+ | 3.37 EUR |
| TSM-113-01-L-DV |
|
Hersteller: SAMTEC
Description: SAMTEC - TSM-113-01-L-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 26Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - TSM-113-01-L-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 26Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 58 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 34+ | 7.54 EUR |
| 35+ | 6.74 EUR |
| TSM-113-01-L-DV |
|
Hersteller: Samtec
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)
| TSM-113-01-L-DV |
|
Hersteller: Samtec
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)