| Anzahl | Preis |
|---|---|
| 1+ | 6.39 EUR |
| 51+ | 5.93 EUR |
| 102+ | 5.67 EUR |
| 510+ | 5.09 EUR |
Produktrezensionen
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Technische Details TSM-113-01-S-DV Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Packaging: Tube, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-113-01-S-DV nach Preis ab 4.26 EUR bis 6.39 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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TSM-113-01-S-DV | Hersteller : Samtec Inc. |
 Description: CONN HEADER SMD 26POS 2.54MMPackaging: Tube Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 609 Stücke: Lieferzeit 10-14 Tag (e) |
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TSM-113-01-S-DV | Hersteller : Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube |
auf Bestellung 11 Stücke: Lieferzeit 14-21 Tag (e) |
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TSM-113-01-S-DV | Hersteller : SAMTEC |
Description: SAMTEC - TSM-113-01-S-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 26Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (04-Feb-2026) |
auf Bestellung 21 Stücke: Lieferzeit 14-21 Tag (e) |
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TSM-113-01-S-DV | Hersteller : Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube |
auf Bestellung 11 Stücke: Lieferzeit 14-21 Tag (e) |
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TSM-113-01-S-DV | Hersteller : Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD Tube |
Produkt ist nicht verfügbar |