auf Bestellung 1672 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 8.45 EUR |
| 10+ | 8.1 EUR |
| 105+ | 6.76 EUR |
| 510+ | 5.74 EUR |
Produktrezensionen
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Technische Details TSM-115-01-L-DV Samtec
Description: CONN HEADER SMD 30POS 2.54MM, Packaging: Tube, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote TSM-115-01-L-DV nach Preis ab 5.21 EUR bis 8.98 EUR
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TSM-115-01-L-DV | Hersteller : Samtec Inc. |
 Description: CONN HEADER SMD 30POS 2.54MMPackaging: Tube Connector Type: Header Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 11697 Stücke: Lieferzeit 10-14 Tag (e) |
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