TW-07-08-G-D-565-075 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 14POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.831" (21.107mm)
Length - Post (Mating): 0.191" (4.851mm)
Length - Stack Height: 0.565" (14.351mm)
Length - Tail: 0.075" (1.905mm)
auf Bestellung 334 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.56 EUR |
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Technische Details TW-07-08-G-D-565-075 Samtec Inc.
Description: CONN BRD STACK 2.00 14POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm), Number of Rows: 2, Number of Positions: 14, Length - Overall Pin: 0.831" (21.107mm), Length - Post (Mating): 0.191" (4.851mm), Length - Stack Height: 0.565" (14.351mm), Length - Tail: 0.075" (1.905mm).
Weitere Produktangebote TW-07-08-G-D-565-075 nach Preis ab 7.33 EUR bis 11.93 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TW-07-08-G-D-565-075 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 14POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm) Number of Rows: 2 Number of Positions: 14 Length - Overall Pin: 0.831" (21.107mm) Length - Post (Mating): 0.191" (4.851mm) Length - Stack Height: 0.565" (14.351mm) Length - Tail: 0.075" (1.905mm) |
auf Bestellung 554 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-07-08-G-D-565-075 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch |
Produkt ist nicht verfügbar |