TW-08-03-L-T-180-100-017 Samtec
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header
| Anzahl | Preis |
|---|---|
| 1+ | 5.47 EUR |
| 25+ | 5.12 EUR |
| 50+ | 4.7 EUR |
| 100+ | 4.28 EUR |
| 500+ | 4.05 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TW-08-03-L-T-180-100-017 Samtec
Description: CONN BRD STACK 2.00 24POS, Length - Tail: 0.100" (2.540mm), Length - Stack Height: 0.180" (4.572mm), Length - Post (Mating): 0.255" (6.477mm), Length - Overall Pin: 0.535" (13.589mm), Number of Positions: 24, Number of Rows: 3, Part Status: Active, Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm), Contact Finish - Post (Mating): Gold, Termination: Solder, Row Spacing: 0.079" (2.00mm), Pitch: 0.079" (2.00mm), Mounting Type: Through Hole, Color: Black, Packaging: Bulk.
Weitere Produktangebote TW-08-03-L-T-180-100-017 nach Preis ab 6.99 EUR bis 6.99 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||
|---|---|---|---|---|---|---|---|---|---|
|
TW-08-03-L-T-180-100-017 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 24POSLength - Tail: 0.100" (2.540mm) Length - Stack Height: 0.180" (4.572mm) Length - Post (Mating): 0.255" (6.477mm) Length - Overall Pin: 0.535" (13.589mm) Number of Positions: 24 Number of Rows: 3 Part Status: Active Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Contact Finish - Post (Mating): Gold Termination: Solder Row Spacing: 0.079" (2.00mm) Pitch: 0.079" (2.00mm) Mounting Type: Through Hole Color: Black Packaging: Bulk |
auf Bestellung 175 Stücke: Lieferzeit 10-14 Tag (e) |
|

