TW-08-03-L-T-223-155 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 24POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 3
Number of Positions: 24
Length - Overall Pin: 0.535" (13.589mm)
Length - Post (Mating): 0.157" (3.988mm)
Length - Stack Height: 0.223" (5.664mm)
Length - Tail: 0.155" (3.937mm)
auf Bestellung 191 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 5.9 EUR |
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Technische Details TW-08-03-L-T-223-155 Samtec Inc.
Description: CONN BRD STACK 2.00 24POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm), Number of Rows: 3, Number of Positions: 24, Length - Overall Pin: 0.535" (13.589mm), Length - Post (Mating): 0.157" (3.988mm), Length - Stack Height: 0.223" (5.664mm), Length - Tail: 0.155" (3.937mm).
Weitere Produktangebote TW-08-03-L-T-223-155 nach Preis ab 8.57 EUR bis 10.72 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TW-08-03-L-T-223-155 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 24POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 3 Number of Positions: 24 Length - Overall Pin: 0.535" (13.589mm) Length - Post (Mating): 0.157" (3.988mm) Length - Stack Height: 0.223" (5.664mm) Length - Tail: 0.155" (3.937mm) |
auf Bestellung 317 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-08-03-L-T-223-155 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |