TW-09-09-L-D-151-100 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 18POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 18
Length - Overall Pin: 0.456" (11.582mm)
Length - Post (Mating): 0.205" (5.200mm)
Length - Stack Height: 0.151" (3.835mm)
Length - Tail: 0.100" (2.540mm)
auf Bestellung 297 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.83 EUR |
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Technische Details TW-09-09-L-D-151-100 Samtec Inc.
Description: CONN BRD STACK 2.00 18POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm), Number of Rows: 2, Number of Positions: 18, Length - Overall Pin: 0.456" (11.582mm), Length - Post (Mating): 0.205" (5.200mm), Length - Stack Height: 0.151" (3.835mm), Length - Tail: 0.100" (2.540mm).
Weitere Produktangebote TW-09-09-L-D-151-100 nach Preis ab 7.35 EUR bis 10.58 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TW-09-09-L-D-151-100 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 18POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 18 Length - Overall Pin: 0.456" (11.582mm) Length - Post (Mating): 0.205" (5.200mm) Length - Stack Height: 0.151" (3.835mm) Length - Tail: 0.100" (2.540mm) |
auf Bestellung 493 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-09-09-L-D-151-100 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |