
TW-09-09-L-D-183-100 Samtec

Board to Board & Mezzanine Connectors 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
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Technische Details TW-09-09-L-D-183-100 Samtec
Description: CONN BRD STACK 2.00 18POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm), Number of Rows: 2, Number of Positions: 18, Length - Overall Pin: 0.456" (11.582mm), Length - Post (Mating): 0.173" (4.394mm), Length - Stack Height: 0.183" (4.658mm), Length - Tail: 0.100" (2.540mm).
Weitere Produktangebote TW-09-09-L-D-183-100 nach Preis ab 5.58 EUR bis 10.16 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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TW-09-09-L-D-183-100 | Hersteller : Samtec Inc. |
![]() Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 18 Length - Overall Pin: 0.456" (11.582mm) Length - Post (Mating): 0.173" (4.394mm) Length - Stack Height: 0.183" (4.658mm) Length - Tail: 0.100" (2.540mm) |
auf Bestellung 295 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-09-09-L-D-183-100 | Hersteller : Samtec Inc. |
![]() Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 18 Length - Overall Pin: 0.456" (11.582mm) Length - Post (Mating): 0.173" (4.394mm) Length - Stack Height: 0.183" (4.658mm) Length - Tail: 0.100" (2.540mm) |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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