TW-13-02-L-D-180-110 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN BRD STACK 2.00 26POS
Number of Positions: 26
Number of Rows: 2
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Contact Finish - Post (Mating): Gold
Termination: Solder
Row Spacing: 0.079" (2.00mm)
Pitch: 0.079" (2.00mm)
Mounting Type: Through Hole
Color: Black
Packaging: Bulk
Length - Tail: 0.110" (2.794mm)
Length - Stack Height: 0.180" (4.572mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Overall Pin: 0.377" (9.576mm)
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Technische Details TW-13-02-L-D-180-110 Samtec Inc.
Description: CONN BRD STACK 2.00 26POS, Number of Positions: 26, Number of Rows: 2, Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm), Contact Finish - Post (Mating): Gold, Termination: Solder, Row Spacing: 0.079" (2.00mm), Pitch: 0.079" (2.00mm), Mounting Type: Through Hole, Color: Black, Packaging: Bulk, Length - Tail: 0.110" (2.794mm), Length - Stack Height: 0.180" (4.572mm), Length - Post (Mating): 0.087" (2.210mm), Length - Overall Pin: 0.377" (9.576mm).
Weitere Produktangebote TW-13-02-L-D-180-110
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Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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TW-13-02-L-D-180-110 | Samtec |
 Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| TW-13-02-L-D-180-110 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH