TW-15-08-G-D-550-170 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.831" (21.107mm)
Length - Post (Mating): 0.111" (2.819mm)
Length - Stack Height: 0.550" (13.970mm)
Length - Tail: 0.170" (4.318mm)
auf Bestellung 231 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.61 EUR |
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Technische Details TW-15-08-G-D-550-170 Samtec Inc.
Description: CONN BRD STACK 2.00 30POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm), Number of Rows: 2, Number of Positions: 30, Length - Overall Pin: 0.831" (21.107mm), Length - Post (Mating): 0.111" (2.819mm), Length - Stack Height: 0.550" (13.970mm), Length - Tail: 0.170" (4.318mm).
Weitere Produktangebote TW-15-08-G-D-550-170 nach Preis ab 12.14 EUR bis 19.31 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TW-15-08-G-D-550-170 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 30POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 0.831" (21.107mm) Length - Post (Mating): 0.111" (2.819mm) Length - Stack Height: 0.550" (13.970mm) Length - Tail: 0.170" (4.318mm) |
auf Bestellung 383 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-15-08-G-D-550-170 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |