TW-15-12-S-D-875-155 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 1.110" (28.194mm)
Length - Post (Mating): 0.080" (2.032mm)
Length - Stack Height: 0.875" (22.225mm)
Length - Tail: 0.155" (3.937mm)
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.57 EUR |
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Technische Details TW-15-12-S-D-875-155 Samtec Inc.
Description: CONN BRD STACK 2.00 30POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 2, Number of Positions: 30, Length - Overall Pin: 1.110" (28.194mm), Length - Post (Mating): 0.080" (2.032mm), Length - Stack Height: 0.875" (22.225mm), Length - Tail: 0.155" (3.937mm).
Weitere Produktangebote TW-15-12-S-D-875-155 nach Preis ab 16.65 EUR bis 26.51 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TW-15-12-S-D-875-155 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 30POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 1.110" (28.194mm) Length - Post (Mating): 0.080" (2.032mm) Length - Stack Height: 0.875" (22.225mm) Length - Tail: 0.155" (3.937mm) |
auf Bestellung 194 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-15-12-S-D-875-155 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |