TW-18-03-G-T-300-085 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN BRD STACK 2.00 54POS
Number of Positions: 54
Number of Rows: 3
Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm)
Contact Finish - Post (Mating): Gold
Termination: Solder
Row Spacing: 0.079" (2.00mm)
Pitch: 0.079" (2.00mm)
Mounting Type: Through Hole
Color: Black
Packaging: Bulk
Length - Tail: 0.085" (2.159mm)
Length - Stack Height: 0.300" (7.620mm)
Length - Post (Mating): 0.150" (3.810mm)
Length - Overall Pin: 0.535" (13.589mm)
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Technische Details TW-18-03-G-T-300-085 Samtec Inc.
Description: CONN BRD STACK 2.00 54POS, Number of Positions: 54, Number of Rows: 3, Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm), Contact Finish - Post (Mating): Gold, Termination: Solder, Row Spacing: 0.079" (2.00mm), Pitch: 0.079" (2.00mm), Mounting Type: Through Hole, Color: Black, Packaging: Bulk, Length - Tail: 0.085" (2.159mm), Length - Stack Height: 0.300" (7.620mm), Length - Post (Mating): 0.150" (3.810mm), Length - Overall Pin: 0.535" (13.589mm).
Weitere Produktangebote TW-18-03-G-T-300-085
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Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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TW-18-03-G-T-300-085 | Samtec |
Headers & Wire Housings Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| TW-18-03-G-T-300-085 |
|
Hersteller: Samtec
Headers & Wire Housings Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch
Headers & Wire Housings Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH