TW-25-03-G-D-253-157 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.535" (13.589mm)
Length - Post (Mating): 0.125" (3.175mm)
Length - Stack Height: 0.253" (6.426mm)
Length - Tail: 0.157" (3.988mm)
auf Bestellung 182 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.66 EUR |
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Technische Details TW-25-03-G-D-253-157 Samtec Inc.
Description: CONN BRD STACK 2.00 50POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm), Number of Rows: 2, Number of Positions: 50, Length - Overall Pin: 0.535" (13.589mm), Length - Post (Mating): 0.125" (3.175mm), Length - Stack Height: 0.253" (6.426mm), Length - Tail: 0.157" (3.988mm).
Weitere Produktangebote TW-25-03-G-D-253-157 nach Preis ab 16.76 EUR bis 26.63 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TW-25-03-G-D-253-157 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 50POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 20.0µin (0.51µm) Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.535" (13.589mm) Length - Post (Mating): 0.125" (3.175mm) Length - Stack Height: 0.253" (6.426mm) Length - Tail: 0.157" (3.988mm) |
auf Bestellung 302 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-25-03-G-D-253-157 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |