TW-30-05-S-D-315-115 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN BRD STACK 2.00 60POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 60
Length - Overall Pin: 0.594" (15.088mm)
Length - Post (Mating): 0.164" (4.166mm)
Length - Stack Height: 0.315" (8.000mm)
Length - Tail: 0.115" (2.921mm)
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 24.15 EUR |
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Technische Details TW-30-05-S-D-315-115 Samtec Inc.
Description: CONN BRD STACK 2.00 60POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 2, Number of Positions: 60, Length - Overall Pin: 0.594" (15.088mm), Length - Post (Mating): 0.164" (4.166mm), Length - Stack Height: 0.315" (8.000mm), Length - Tail: 0.115" (2.921mm).
Weitere Produktangebote TW-30-05-S-D-315-115 nach Preis ab 43.91 EUR bis 43.91 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||
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| TW-30-05-S-D-315-115 | Hersteller : Samtec Inc. |
Description: CONN BRD STACK 2.00 60POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 60 Length - Overall Pin: 0.594" (15.088mm) Length - Post (Mating): 0.164" (4.166mm) Length - Stack Height: 0.315" (8.000mm) Length - Tail: 0.115" (2.921mm) |
auf Bestellung 112 Stücke: Lieferzeit 10-14 Tag (e) |
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TW-30-05-S-D-315-115 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
Produkt ist nicht verfügbar |