TXS0206-29YFPR Texas Instruments
Hersteller: Texas InstrumentsDescription: IC TRANSLATOR BIDIR 20DSBGA
Features: SIM Card Interface
Packaging: Bulk
Package / Case: 20-XFBGA, DSBGA
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 60Mbps
Supplier Device Package: 20-DSBGA
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.1 V ~ 3.6 V
Voltage - VCCB: 1.1 V ~ 3.6 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 729972 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 460+ | 1.07 EUR |
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Technische Details TXS0206-29YFPR Texas Instruments
Description: IC TRANSLATOR BIDIR 20DSBGA, Packaging: Tape & Reel (TR), Features: SIM Card Interface, Package / Case: 20-XFBGA, DSBGA, Output Type: Open Drain, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Data Rate: 60Mbps, Supplier Device Package: 20-DSBGA, Channel Type: Bidirectional, Translator Type: Voltage Level, Channels per Circuit: 4, Voltage - VCCA: 1.1 V ~ 3.6 V, Voltage - VCCB: 1.1 V ~ 3.6 V, Part Status: Obsolete, Number of Circuits: 1.
Weitere Produktangebote TXS0206-29YFPR nach Preis ab 2.2 EUR bis 2.59 EUR
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TXS0206-29YFPR | Hersteller : Texas Instruments |
Description: IC TRANSLATOR BIDIR 20DSBGA Features: SIM Card Interface Packaging: Cut Tape (CT) Package / Case: 20-XFBGA, DSBGA Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 60Mbps Supplier Device Package: 20-DSBGA Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.1 V ~ 3.6 V Voltage - VCCB: 1.1 V ~ 3.6 V Part Status: Obsolete Number of Circuits: 1 |
auf Bestellung 91 Stücke: Lieferzeit 10-14 Tag (e) |
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TXS0206-29YFPR | Hersteller : Texas Instruments |
Translation - Voltage Levels MMC SD Card Memory Stick Vltg-Trans |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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TXS0206-29YFPR | Hersteller : Texas Instruments |
Description: IC TRANSLATOR BIDIR 20DSBGA Packaging: Tape & Reel (TR) Features: SIM Card Interface Package / Case: 20-XFBGA, DSBGA Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 60Mbps Supplier Device Package: 20-DSBGA Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.1 V ~ 3.6 V Voltage - VCCB: 1.1 V ~ 3.6 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |