UJA1131HW/FD/5V/0Y NXP USA Inc.
Hersteller: NXP USA Inc.Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1485 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 11.18 EUR |
| 10+ | 8.60 EUR |
| 25+ | 7.96 EUR |
| 100+ | 7.25 EUR |
| 250+ | 6.91 EUR |
| 500+ | 6.71 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details UJA1131HW/FD/5V/0Y NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE, Packaging: Tape & Reel (TR), Package / Case: 48-TQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 2V ~ 28V, Current - Supply: 2.8mA, Supplier Device Package: 48-HTQFP (10x10), Part Status: Active, Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote UJA1131HW/FD/5V/0Y
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
UJA1131HW/FD/5V/0Y | Hersteller : NXP Semiconductors |
High Performance System Basis Chip |
Produkt ist nicht verfügbar |
|
|
|
UJA1131HW/FD/5V/0Y | Hersteller : NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE Packaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|
| UJA1131HW/FD/5V/0Y | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Buck/boost HS-CAN/LIN system basis chip |
Produkt ist nicht verfügbar |